Ibiden's board has approved about ¥151bn of planned investment to expand production of high-function IC package substrates, aimed mainly at AI servers, with new capacity coming on line in stages from fiscal 2029. The company announced the decision on 29 October 2026 in a disclosure on capital spending for the acquisition of fixed assets.
What the board approved
The spending is centred on the factory building known as Cell6 at the company's site in Ogaki, Gifu Prefecture, and also covers other overseas plants. The notice gives the amount as approximately ¥151bn and labels it as planned. It does not break the total down between the Ogaki site and the overseas factories, and it does not name those factories.
Timing and what the substrates are for
Ibiden says operations will begin sequentially from fiscal 2029, with mass production planned from that point. Nothing in the notice describes this capacity as already running.
The notice says the expansion targets high-function IC package substrates for CPUs. Ibiden's stated reasoning is that demand is expected to grow as AI moves from training to inference and then to agentic AI. That is the company's own expectation. The notice gives no output volumes and names no customers.
Earnings effect
Ibiden says the investment will have a minor effect on consolidated results for the current fiscal year. It gives no figures for later years.