Asahi Diamond Industrial and Tokyo Seimitsu have agreed to put a combined ¥1.23bn into their joint venture so it can build a mass-production site for hub blades in Thailand. Asahi Diamond's own share is ¥615mn, matching its partner's.
Equal money, unchanged stakes
The joint venture will raise ¥1.23bn through a capital increase, and each parent will take up ¥615mn of it. Both keep a 50% holding afterwards. The money is earmarked for manufacturing equipment and infrastructure at the Thai site. The venture was set up on 9 May 2025, is based in Ichihara, Chiba, and has capital of ¥1bn.
What the plant would make
Hub blades are used mainly in the dicing step, where silicon wafers are cut into semiconductor chips. The planned site is in Khlong Luang District, Pathum Thani Province. It would be run by a new production subsidiary, which has no name yet. Planned equipment and infrastructure spending is ¥1.23bn.
Timetable
Construction is planned to start in January 2027 and finish in December 2027, with operations beginning in April 2028. Asahi Diamond says these are current plans that may change. The release gives no production volumes or customer commitments.
Asahi Diamond says the effect on its consolidated results for the year to March 2027 is minor. Over the medium to long term, it expects the plant to help the group capture semiconductor-market demand.